Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/085110
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology capable of enhancing the heat dissipation characteristics of a semiconductor device. A semiconductor device according to the present invention is provided with: a heat-radiation plate; a layer member connected to the heat-radiation plate; and a first semiconductor element and a second semiconductor element. The first semiconductor element and the second semiconductor element are connected to the layer member on the opposite side from the heat-radiation plate and are separated from each other with a gap therebetween. The heat-radiation plate includes a thick wall section and a thin wall section that is thinner than the thick wall section. The thin wall section is in contact with a groove section provided in a surface of the heat-radiation plate, said surface being on the opposite side from the layer member, and overlaps the gap in plan view.
More Like This:
| JP2023010103 | SEMICONDUCTOR DEVICE |
| JP7160102 | Semiconductor device manufacturing method and thermally conductive sheet |
| JPH0945826 | HEAT DISSIPATION FIN |
Inventors:
TSUNODA TETSUJIRO (JP)
Application Number:
PCT/JP2020/039538
Publication Date:
April 28, 2022
Filing Date:
October 21, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36
Foreign References:
| JP2016115782A | 2016-06-23 | |||
| JPH1041440A | 1998-02-13 | |||
| JP2010153785A | 2010-07-08 | |||
| JP2015015274A | 2015-01-22 | |||
| JP2006202798A | 2006-08-03 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF:
Previous Patent: MOTOR DRIVE SYSTEM AND MOTOR DRIVE METHOD
Next Patent: LASER APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Next Patent: LASER APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE