Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/162912
Kind Code:
A1
Abstract:
[Problem] To provide a semiconductor device with improved heat dissipation. [Solution] A semiconductor device which, on the semiconductor chip back surface, has protrusions formed from the same semiconductor as that of the semiconductor chip, wherein the protrusions are covered with a metal that has good thermal conductivity. By covering the protrusions with a metal, the heat dissipation from the protruding portion is improved, and it is possible to improve heat dissipation of the entire semiconductor chip. Further, heat dissipation can be further improved by adopting structures in which the protrusions covered by a metal in the chip center portion are longer than the protrusions covered by metal in the chip in the peripheral portion, and structures in which the density of protrusions covered by metal in the chip center portion is higher than the density of the protrusions covered by metal in the chip peripheral portion.
Inventors:
HANNUKI KEIJI (JP)
OGAWA KAZUKO (JP)
OGAWA KAZUKO (JP)
Application Number:
PCT/JP2021/003409
Publication Date:
August 04, 2022
Filing Date:
January 29, 2021
Export Citation:
Assignee:
SANKEN ELECTRIC CO LTD (JP)
International Classes:
H01L23/373
Foreign References:
JP2009081274A | 2009-04-16 | |||
US20140015118A1 | 2014-01-16 | |||
JP2010239018A | 2010-10-21 | |||
JP2010239017A | 2010-10-21 | |||
US20150171046A1 | 2015-06-18 |
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