Title:
SEMICONDUCTOR DEVICES HAVING INTERPOSER STRUCTURE AND METHODS THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/068221
Kind Code:
A1
Abstract:
Embodiments of semiconductor devices and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and an interposer structure vertically between the first and second semiconductor structures. The first semiconductor structure includes a plurality of logic process-compatible devices and a first bonding layer comprising a plurality of first bonding contacts. The second semiconductor structure includes an array of NAND memory cells and a second bonding layer comprising a plurality of second bonding contacts. The interposer structure includes a first interposer bonding layer having a plurality of first interposer contacts disposed at a first side of the interposer structure, and a second interposer bonding layer having a plurality of second interposer contacts disposed at a second side opposite of the first side of the interposer structure. The first interposer contacts is conductively connected to the second interposer contacts.
Inventors:
LIU JUN (CN)
Application Number:
PCT/CN2019/110708
Publication Date:
April 15, 2021
Filing Date:
October 12, 2019
Export Citation:
Assignee:
YANGTZE MEMORY TECH CO LTD (CN)
International Classes:
H01L27/11578
Foreign References:
| CN109075170A | 2018-12-21 | |||
| CN109075170A | 2018-12-21 | |||
| US20190081069A1 | 2019-03-14 | |||
| US20160358865A1 | 2016-12-08 | |||
| US20190088589A1 | 2019-03-21 | |||
| US10304852B1 | 2019-05-28 | |||
| US10354980B1 | 2019-07-16 |
Attorney, Agent or Firm:
NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD. (CN)
Download PDF:
Previous Patent: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF
Next Patent: METHODS FOR WAFER WARPAGE CONTROL
Next Patent: METHODS FOR WAFER WARPAGE CONTROL