SEMICONDUCTOR ELEMENT IMAGE RECOGNITION DEVICE AND SEMICONDUCTOR ELEMENT IMAGE RECOGNITION METHOD

WIPO Patent Application WO/2013/080956

A1

An LED element (13) is mounted on a mounting member (11), with the surrounding area filled with a clear insulating plastic (16). The insulating plastic (16) contains a fluorescent substance that converts light emitted from a side surface of the LED element (13) to light of another wavelength. During imaging, in a state in which light is shone from a light source (23) to the mounting surface of the mounting member (11) of the LED element (13), causing the fluorescent substance within the insulating plastic (16) surrounding the LED element (13) to emit light: the mounting surface of the mounting member (11) of the LED element (13) is imaged through an optical filter (22), said imaging being done by an imaging device (21); the shape of the LED element (13) surrounded by the insulating plastic (16) made bright by the fluorescence of the fluorescent substance is subjected to image recognition; and the position of the LED element (13) is subjected to image recognition. Moreover, on the basis of the image imaged by the imaging device (21), the shape of the insulating plastic (16) surrounding the LED element (13) is subjected to image recognition, and the existence of a filling defect in the insulating plastic (16) is assessed.

TSUKADA KENJI (JP)
SUZUKI MASATO (JP)
KAWAJIRI AKIHIRO (JP)

PCT/JP2012/080581

June 06, 2013

November 27, 2012

Click for automatic bibliography generation  

FUJI MACHINE MFG (JP)

G01B11/00; G01N21/64; G01N21/88; G01N21/956; H01L21/56; H01L21/60; H01L33/48; H01L33/50

WO2010004835A1

2010-01-14

JP2009180524A	2009-08-13
JPH10267628A	1998-10-09
JPH05121512A	1993-05-18
JPH11345865A	1999-12-14
JP2008197026A	2008-08-28

KAKO, Muneo (JP)
Muneo Kako (JP)

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