Title:
SEMICONDUCTOR ELEMENT SOCKET
Document Type and Number:
WIPO Patent Application WO/2013/080675
Kind Code:
A1
Abstract:
One of the objectives of the present invention is to provide a semiconductor element socket that can secure an appropriate stroke amount for a contact probe, and can increase the compactness of the contact probe. The semiconductor element socket (10) is provided with: a mobile base member (30) disposed movably in the vertical direction on a base member (20) by means of a mobile base spring (12) attached to the base member (20); and a mobile pedestal (40) that is disposed on the mobile base member (30) and that supports an IC package (50). By means of the mobile pedestal (40) moving downwards, it is possible to cause the mobile base member (30) to move downwards.
Inventors:
HEMMI AKIHIKO (JP)
Application Number:
PCT/JP2012/076137
Publication Date:
June 06, 2013
Filing Date:
October 09, 2012
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
G01R31/26; H01R33/76
Foreign References:
| JP2007071810A | 2007-03-22 | |||
| JP2001326048A | 2001-11-22 |
Attorney, Agent or Firm:
TANI & ABE, p. c. (JP)
Patent business corporation A valley and Abe patent firm (JP)
Patent business corporation A valley and Abe patent firm (JP)
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Claims:
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