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Patent Searching and Data


Title:
SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2019/098026
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide: a semiconductor encapsulation resin composition that enables encapsulation resin blackening and a low dissipation factor for the encapsulation resin; and a semiconductor package. This semiconductor encapsulation resin composition contains an epoxy resin, a curing agent, and a low-order titanium oxide where the oxidation number of titanium atom is less than +IV. This semiconductor package 1 comprises a semiconductor chip 2 and an encapsulating resin 4 that covers the semiconductor chip 2 and that is a cured product of the semiconductor encapsulation resin composition.

Inventors:
NISHIDONO KYOKO
AKASHI TAKAHIRO
Application Number:
PCT/JP2018/040473
Publication Date:
May 23, 2019
Filing Date:
October 31, 2018
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L63/00; C08K3/22; C08K3/36; C08K5/5415; C08L45/00; H01L23/29; H01L23/31
Foreign References:
JP2015106674A2015-06-08
JPH09208673A1997-08-12
JPH09208666A1997-08-12
JP2006278959A2006-10-12
JP2002363379A2002-12-18
JP2018162351A2018-10-18
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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