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Patent Searching and Data


Title:
SEMICONDUCTOR ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/233333
Kind Code:
A1
Abstract:
Provided are a semiconductor encapsulation structure and an encapsulation method thereof. The semiconductor encapsulation structure comprises: a chip, a silver bonding pad, a lead, and an encapsulation body, wherein the silver bonding pad comprises a lead bonding pad; one end of the lead is connected to the lead bonding pad, and the other end thereof is connected to the chip; and the encapsulation body encapsulates the chip and the lead, and the lead bonding pad protrudes out of the lower surface of the encapsulation body. According to the present invention, since the lead bonding pad protrudes out of the lower surface of the encapsulation body, during connection to a circuit board, the semiconductor encapsulation structure can be connected to the circuit board by merely smearing the lower surface of the lead bonding pad with a small amount of tin paste and then performing reflow soldering. With the aid of the support function of the lead bonding pad, an encapsulated semiconductor and the circuit board can maintain a sufficient gap of a preset distance therebetween. Since the lead bonding pad is a silver bonding pad, same has a very high melting point, and during reflow soldering, the problem of diffusion to the surroundings due to melting will not occur, so as to prevent the problem of a short circuit due to diffusion during soldering.

Inventors:
YEW, Cheekiang (CN)
Application Number:
PCT/CN2021/094600
Publication Date:
November 25, 2021
Filing Date:
May 19, 2021
Export Citation:
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Assignee:
DONGGUAN IC CARRIER TECHNOLOGY CO., LTD. (CN)
International Classes:
H01L21/56; H01L23/31; H01L23/488
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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