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Patent Searching and Data


Title:
SEMICONDUCTOR LASER DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/066821
Kind Code:
A1
Abstract:
This semiconductor laser device comprises: a semiconductor laser chip that emits laser light; a plate-like base; and a block that protrudes from the base and supports the semiconductor laser chip. The block has a support surface and a wire bonding surface. The support surface is a surface that faces a first side in a first direction perpendicular to an emission direction of the laser light and supports the semiconductor laser chip. The wire bonding surface is a surface to which a wire conducted to the semiconductor laser chip is connected. The wire bonding surface is disposed to be deviated from the support surface in a second direction perpendicular to the emission direction and the first direction. The wire bonding surface is inclined with respect to the support surface to be located on a second side in the first direction as a distance from the support surface in the second direction increases.

Inventors:
SAKAI KENJI (JP)
IZUMI KAZUYOSHI (JP)
Application Number:
PCT/JP2019/036698
Publication Date:
April 02, 2020
Filing Date:
September 19, 2019
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01S5/022
Foreign References:
JP2014022379A2014-02-03
JPH10256643A1998-09-25
JP2013258434A2013-12-26
JP2011066327A2011-03-31
JP2014049523A2014-03-17
US20100008093A12010-01-14
Attorney, Agent or Firm:
YOSHIDA Minoru et al. (JP)
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