Title:
SEMICONDUCTOR LASER DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/110783
Kind Code:
A1
Abstract:
This semiconductor laser device (10) comprises: a semiconductor laminate (30); and a first opening part (27) formed to extend along a first direction from a front end surface (36) to a rear end surface (37) and also comprises: an insulation layer (21) disposed above the semiconductor laminate (30); a first electrode (25) disposed above the semiconductor laminate (30); a second electrode disposed above the first electrode (25) and the insulation layer (21); and an auxiliary adhesion layer (22) disposed between the second electrode (23) and the insulation layer (21), wherein the auxiliary adhesion layer (22) has a second opening part (26) that at least partially overlaps the first opening part (27) in a plan view, at least a portion of the first electrode (25) is disposed inside the first opening part (27) and the second opening part (26), and the second electrode (23) and the auxiliary adhesion layer (22) are located above the insulation layer (21) between at least one end surface among the front end surface (36) and the rear end surface (37) and the first opening part (27).
Inventors:
KOUNO KEISHI
HIROYAMA RYOJI
YOSHIDA SHINJI
SAMONJI KATSUYA
HIROYAMA RYOJI
YOSHIDA SHINJI
SAMONJI KATSUYA
Application Number:
PCT/JP2019/044934
Publication Date:
June 04, 2020
Filing Date:
November 15, 2019
Export Citation:
Assignee:
PANASONIC SEMICONDUCTOR SOLUTIONS CO LTD (JP)
International Classes:
H01S5/022; H01S5/042; H01S5/22
Domestic Patent References:
| WO2018180524A1 | 2018-10-04 |
Foreign References:
| JP2011135016A | 2011-07-07 | |||
| JP2005109291A | 2005-04-21 | |||
| US20170054271A1 | 2017-02-23 |
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
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