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Title:
SEMICONDUCTOR MODULE AND PRODUCTION METHOD THEREFOR, DRIVE DEVICE EQUIPPED WITH SEMICONDUCTOR MODULE, AND ELECTRIC POWER STEERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/150449
Kind Code:
A1
Abstract:
Provided is a semiconductor module wherein: a lead frame (3 (31, 32)) of an internal wiring material has a bilayer three-dimensional wiring structure; power semiconductor elements (2 (21, 22)) and the bilayer lead frames (3 (31, 32)) are alternately laminated; and a portion of the second-layer lead frame (32) is drawn out to a heat-dissipating surface (31S) of the first-layer lead frame (31) so as to form a lead-out part (32H) that has a heat-dissipating surface (32S) for dissipating heat to the outside.

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Inventors:
KAWAI YASUHIRO (JP)
SHIMIZU YASUHIRO (JP)
Application Number:
PCT/JP2017/005281
Publication Date:
August 23, 2018
Filing Date:
February 14, 2017
Export Citation:
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Assignee:
NSK LTD (JP)
International Classes:
H01L25/07; H01L23/28; H01L23/48; H01L25/18
Foreign References:
JP2010283236A2010-12-16
JP2009043820A2009-02-26
JP2008235589A2008-10-02
JP2004296663A2004-10-21
JP2016014596A2016-01-28
JP2016197677A2016-11-24
JP2004140068A2004-05-13
JP2002026251A2002-01-25
JP2014053457A2014-03-20
JP2014072316A2014-04-21
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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