Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2018/088141
Kind Code:
A1
Abstract:
This semiconductor module comprises: a circuit board 1 on which a first semiconductor chip 3 and a second semiconductor chip 4 are mounted and which has a first through-hole 11 having a conductor foil 12 formed thereinside; a press-fit terminal 13 which is electrically connected to the conductor foil 12 in the first through-hole 11 of the circuit board 1; and a second resin 23 disposed on the obverse surface 1a side and the reverse surface 1b side of the circuit board 1. Furthermore, the press-fit terminal 13 is provided with a pressure contact part which is inserted into the first through-hole 11 by pressure and which is electrically connected to the conductor foil 12 in the first through-hole 11, and the second resin 23 on the obverse surface 1a side and the second resin 23 on the reverse surface 1b side of the circuit board 1 are integrally formed via a second resin 25 filling the first through-hole 11.
Inventors:
WATANABE TSUBASA (JP)
HOSHIKA HIROAKI (JP)
YOGO TAKAYUKI (JP)
HOSHIKA HIROAKI (JP)
YOGO TAKAYUKI (JP)
Application Number:
PCT/JP2017/037469
Publication Date:
May 17, 2018
Filing Date:
October 17, 2017
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H01L23/12; H01L25/04; H01L25/18; H01R12/58; H02G3/16
Domestic Patent References:
| WO2016017299A1 | 2016-02-04 |
Foreign References:
| US7294007B1 | 2007-11-13 | |||
| JP2010067773A | 2010-03-25 | |||
| JP2009289447A | 2009-12-10 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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