Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2020/184052
Kind Code:
A1
Abstract:
This semiconductor module is provided with: a semiconductor element (30) having a first main electrode (31E) on one surface side and a second main electrode (31C) on a back surface side; a first conductive member (40E) disposed on the one surface side and connected to the first main electrode; a second conductive member (40C) disposed on the back surface side and connected to the second main electrode; and main terminals (60) which extend from the conductive members and include a first main terminal (60E) continuous with the first conductive member and a second main terminal (60C) continuous with the second conductive member. The main terminals are disposed so as to mutually cancel out a magnetic flux which is generated when a main electric current flows, and include: an opposing portion (61) in which the first main terminal and the second main terminal are spaced apart from and opposite each other; a non-opposing portion (62E) opposite the first conductive member side and continuous with the opposing portion of the first main terminal; a first connecting portion (63E) formed in the non-opposing portion of the first main terminal; and a second connecting portion (63C) formed in the opposing portion of the second main terminal in such a way that the position in which the second connecting portion (63C) is formed overlaps the first connecting portion in a width direction.
Inventors:
ISHINO HIROSHI (JP)
MIWA RYOTA (JP)
OMAE SHOICHIRO (JP)
NAGASE TAKUO (JP)
MIWA RYOTA (JP)
OMAE SHOICHIRO (JP)
NAGASE TAKUO (JP)
Application Number:
PCT/JP2020/005570
Publication Date:
September 17, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/29; H01L23/48
Domestic Patent References:
| WO2015145711A1 | 2015-10-01 |
Foreign References:
| JP2015015301A | 2015-01-22 | |||
| JP2009005512A | 2009-01-08 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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