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Patent Searching and Data


Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/065957
Kind Code:
A1
Abstract:
A semiconductor module (10) comprises a plurality of semiconductor elements, a resin mold (120), and a plurality of conductive members. Each of the plurality of semiconductor elements comprises a gate electrode, a first electrode, and a second electrode. Each of the plurality of conductive members includes: a common-wire electrode (111) that is exposed from the resin mold on the upper surface side or the lower surface side of the semiconductor module and is electrically connected to at least one of the first electrode and the second electrode; and a non-common-wire electrode (101-104) that is exposed from the resin mold and is electrically connected to an electrode of the semiconductor element different from the common-wire electrode. The wire width of a common electrode connected to the common-wire electrode is wider than the wire width of a non-common-wire electrode. The plurality of semiconductor elements and the plurality of conductive members are arranged such that a common wire is not electrically connected to the non-common-wire electrode if the common wire is connected to the common-wire electrode, and the common wire can be disposed extending from one side to the other opposing side on the surface of the resin mold on which the common-wire electrode is exposed.

Inventors:
MIYACHI SYUHEI (JP)
FUJITA TOSHIHIRO (JP)
SAITOU ATSUSHI (JP)
NAGASE NOBORU (JP)
Application Number:
PCT/JP2020/037024
Publication Date:
April 08, 2021
Filing Date:
September 29, 2020
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
WO2013146212A12013-10-03
Foreign References:
US20080224323A12008-09-18
US20060017141A12006-01-26
JP2003046053A2003-02-14
JP2004335493A2004-11-25
JP2008166382A2008-07-17
JP2010287699A2010-12-24
Attorney, Agent or Firm:
YAMADA, Tsuyoshi (JP)
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