Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/065958
Kind Code:
A1
Abstract:
A semiconductor module (1) comprises: two semiconductor elements (10, 20), each having a substantially quadrilateral shape when viewed from the upper surface thereof and superposed in the vertical direction so as to at least partially overlap with each other; conductive members (121, 123, 125) that are superposed on the upper surface side or the lower surface side of the two semiconductor elements and electrically connected to at least one of the two semiconductor elements; and a resin mold (130) that integrally seals the two semiconductor elements and the conductive members. Among the two semiconductor elements, the lower semiconductor element (20) disposed below is also disposed such that the positions of the end portions (21-24) of at least two substantially perpendicular sides of the substantially quadrilateral shape can be observed when the semiconductor module is viewed from the upper surface thereof without the resin mold present.
Inventors:
MIYACHI SYUHEI (JP)
Application Number:
PCT/JP2020/037025
Publication Date:
April 08, 2021
Filing Date:
September 29, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L21/60; H01L25/065; H01L25/18
Domestic Patent References:
| WO2017130420A1 | 2017-08-03 |
Foreign References:
| JP2005277014A | 2005-10-06 | |||
| JP2017037911A | 2017-02-16 | |||
| JP2005347327A | 2005-12-15 | |||
| JP2019145776A | 2019-08-29 |
Attorney, Agent or Firm:
YAMADA, Tsuyoshi (JP)
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