Title:
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND CU ALLOY CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/179250
Kind Code:
A1
Abstract:
A semiconductor package manufacturing method of the present invention is characterized by having: a step for preparing a lead frame having a section to be cut, said section being formed of a Cu alloy; a step for applying a bonding material to the section to be cut, said bonding material containing Sn or an Sn alloy; a step for forming an intermetallic compound having voids by reacting, by heating the section to be cut, the Sn or the Sn alloy contained in the bonding material with the Cu alloy constituting the section to be cut; and a step for cutting, with the intermetallic compound, the section to be cut.
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Inventors:
WASHIZUKA SEITARO (JP)
Application Number:
PCT/JP2017/000475
Publication Date:
October 19, 2017
Filing Date:
January 10, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/50; C22C9/06; C22C9/00; C22C9/01; C22C9/05; C22C12/00; C22C13/00
Foreign References:
JP2005228835A | 2005-08-25 | |||
JPH10150136A | 1998-06-02 | |||
JP2005288458A | 2005-10-20 | |||
JPS6430994A | 1989-02-01 | |||
JPH05145004A | 1993-06-11 | |||
JP2002171055A | 2002-06-14 | |||
JP2012122095A | 2012-06-28 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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