Title:
SEMICONDUCTOR POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2022/162875
Kind Code:
A1
Abstract:
[Problem] To provide a semiconductor power module including a DBC substrate having metal patterns with different thicknesses, and thereby reduce the number of components, simplify the manufacturing process, and reduce the manufacturing cost of the semiconductor power module. The present invention also improves the flexibility of the structural design of a semiconductor power module. [Solution] In a package structure of this semiconductor power module in which a power chip and a control chip are mounted on a DBC substrate, metal patterns of the DBC substrate include a power chip mounting part (power part) and a control chip mounting part (signal part), and the metal thickness of the power chip mounting part is greater than the metal thickness of the control chip mounting part. Also, the power chip is a flip chip type and has a structure in which clip leads are provided in wiring.
Inventors:
PARK CHANGYOUNG (KR)
KIM JUYOUNG (KR)
KIM JUYOUNG (KR)
Application Number:
PCT/JP2021/003266
Publication Date:
August 04, 2022
Filing Date:
January 29, 2021
Export Citation:
Assignee:
SANKEN ELECTRIC CO LTD (JP)
SANKEN ELECTRIC KOREA CO LTD (KR)
SANKEN ELECTRIC KOREA CO LTD (KR)
International Classes:
H01L23/12; H01L23/36; H01L25/07; H01L25/18
Domestic Patent References:
| WO2005081311A1 | 2005-09-01 |
Foreign References:
| JP2012531728A | 2012-12-10 | |||
| JP2016507902A | 2016-03-10 | |||
| JP2007201346A | 2007-08-09 | |||
| JP2020155640A | 2020-09-24 | |||
| JP2015008242A | 2015-01-15 | |||
| JP2013058726A | 2013-03-28 | |||
| JPH01266786A | 1989-10-24 | |||
| JP2019165190A | 2019-09-26 |
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