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Patent Searching and Data


Title:
SEMICONDUCTOR PRODUCTION DEVICE SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/117743
Kind Code:
A1
Abstract:
A semiconductor production device sealing material that comprises a rubber composition that includes a fluorine rubber and a phenolic resin powder. There are 1–50 parts by mass of the phenolic resin powder per 100 parts by mass of the fluorine rubber. The average grain size of the phenolic resin powder is 1–20 μm.

Inventors:
YASUDA HIROAKI (JP)
HAMAMURA TAKEHIRO (JP)
ITO TAKAO (JP)
Application Number:
PCT/JP2020/045739
Publication Date:
June 17, 2021
Filing Date:
December 08, 2020
Export Citation:
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Assignee:
MITSUBISHI CABLE IND LTD (JP)
International Classes:
C08L27/12; C08L61/06; C09K3/10
Foreign References:
JP2020070326A2020-05-07
JPS58152032A1983-09-09
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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