Title:
SEMICONDUCTOR TESTING SOCKET
Document Type and Number:
WIPO Patent Application WO/2013/042907
Kind Code:
A2
Abstract:
A semiconductor testing socket according to the present invention comprises a conductive silicon part formed in a region where a semiconductor device lead is contacted; an insulative silicon part formed in a region where the semiconductor device lead is not contacted, so as to support the conductive silicon part, and serving as an insulating layer; and at least one insulative reinforcement line formed in a region where the lead of the conductive silicon part is contacted. As a semiconductor is pressed against a contact surface of the semiconductor testing socket, a silicon rubber of the semiconductor testing socket and conductive powders are pushed out in all directions, which makes it possible to minimize damage to the rubber film caused by friction of the contact portion.
Inventors:
SHIN JONG CHEON (KR)
HA DONG HO (KR)
HA DONG HO (KR)
Application Number:
PCT/KR2012/007415
Publication Date:
March 28, 2013
Filing Date:
September 17, 2012
Export Citation:
Assignee:
SHIN JONG CHEON (KR)
HA DONG HO (KR)
HA DONG HO (KR)
International Classes:
H01R33/76; G01R31/26; H01R11/01
Foreign References:
KR101019721B1 | 2011-03-07 | |||
KR20110004324A | 2011-01-13 | |||
KR100681156B1 | 2007-02-05 | |||
KR101004296B1 | 2010-12-28 |
Attorney, Agent or Firm:
KIM, In Han et al. (KR)
김인한 (KR)
김인한 (KR)
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Claims: