Title:
SEMICONDUCTOR WAFER EVALUATION METHOD AND METHOD FOR MANAGING SEMICONDUCTOR WAFER MANUFACTURING STEP
Document Type and Number:
WIPO Patent Application WO/2018/193762
Kind Code:
A1
Abstract:
The present invention provides an evaluation method for a semiconductor wafer fabricated by: chamfering and grinding an edge of a semiconductor wafer sliced from a semiconductor ingot and comprising major surfaces including a major front surface and a major back surface; polishing the major front surface or both the major front surface and the major back surface of the semiconductor wafer that has been chamfered and ground, obtaining a semiconductor wafer having the major surfaces and a chamfered surface; and subjecting the semiconductor wafer to mirror surface chamfering processing. The evaluation method is characterized in that: the major surfaces of the semiconductor wafer in the vicinity of the chamfered surface are irradiated with laser light; an inspection is performed in dark field by detecting scattered light from an irradiated surface; and an inspection for over-polish involving polishing beyond a boundary between the chamfered surface and the major surfaces due to the mirror surface chamfer processing is performed. Thus, there is provided a semiconductor wafer evaluation method which makes it possible to evaluate the presence or absence of over-polish into the semiconductor wafer major surfaces due to mirror surface chamfer processing, and to evaluate the measurement of the amount of penetration by over-polish in a short time and non-destructively.
Inventors:
TOMII KAZUYA (JP)
Application Number:
PCT/JP2018/010111
Publication Date:
October 25, 2018
Filing Date:
March 15, 2018
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L21/304; B24B49/12; H01L21/66
Domestic Patent References:
| WO2015196163A1 | 2015-12-23 |
Foreign References:
| JP2006237055A | 2006-09-07 | |||
| JP2010060532A | 2010-03-18 | |||
| JP2017072461A | 2017-04-13 | |||
| JP2014085296A | 2014-05-12 | |||
| JP2012178463A | 2012-09-13 | |||
| JP2012013632A | 2012-01-19 | |||
| JP2008216054A | 2008-09-18 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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