Title:
SENSOR ASSEMBLY AND DOOR LOCK DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/105264
Kind Code:
A1
Abstract:
The present invention is a sensor assembly 70 that is used in a door lock device DL provided with a latch 30, a ratchet 31, a drive unit 11 that drives the ratchet 31 and releases the engagement of the ratchet 31 and the latch 30, and a case 21 that accommodates the drive unit 11, the sensor assembly being provided with a sensor 61 that detects the action of the ratchet 31 when the engagement of the ratchet 31 and the latch 30 is released, wherein the sensor assembly 70 is provided with: a connector 71 that holds connection conductors 75 electrically connected to the sensor, and is attached to the case 21; a sensor base 73 that holds the sensor 61; a plurality of electric wires 72 that connect the plurality of connection conductors 75 and a plurality of terminal units 78 of the sensor 61; and a waterproof member 82 that comprises a photo-curing resin for covering, along with the sensor base 73, connecting units 81 of the terminal units 78 and the electric wires 72.
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Inventors:
NAKATSUKA FUYUKI (JP)
KIMURA SHUNTARO (JP)
MIZUMOTO NAO (JP)
KIMURA SHUNTARO (JP)
MIZUMOTO NAO (JP)
Application Number:
PCT/JP2019/036606
Publication Date:
May 28, 2020
Filing Date:
September 18, 2019
Export Citation:
Assignee:
MITSUI KINZOKU ACT CORP (JP)
International Classes:
E05B85/02; B60J5/00; B60J5/10; E05B77/34; E05B81/14; E05B81/66; E05B85/24
Foreign References:
| JP2012158866A | 2012-08-23 | |||
| JP2004319288A | 2004-11-11 | |||
| JP2002033438A | 2002-01-31 | |||
| JP2013083086A | 2013-05-09 | |||
| JP2006165017A | 2006-06-22 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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