Title:
SENSOR ENCAPSULATION STRUCTURE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/082270
Kind Code:
A1
Abstract:
Disclosed in the present invention are a sensor encapsulation structure and an electronic apparatus. The sensor encapsulation structure comprises a substrate and a encapsulation shell arranged on the substrate, with a cavity being enclosed by the substrate and the encapsulation shell; the sensor encapsulation structure further comprises an MEMS chip mounted on the substrate, and the MEMS chip is positioned in the cavity; the encapsulation shell comprises a core layer, a first conductive layer combined on an inner surface of the core layer, and a second conductive layer combined on an outer surface of the core layer; a lower end of the first conductive layer is connected to the substrate by means of a first electric connection portion, and a lower end of the second conductive layer is connected to the substrate by means of a second electric connection portion; and the first conductive layer and the second conductive layer are electrically connected together on the substrate and are grounded. One technical effect of the present invention is that the radio frequency interference resistance of a product can be effectively improved.
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Inventors:
PANG SHENGLI (CN)
Application Number:
PCT/CN2019/130228
Publication Date:
May 06, 2021
Filing Date:
December 31, 2019
Export Citation:
Assignee:
GOERTEKMICROELECTRONICS CO LTD (CN)
International Classes:
H04R19/04
Foreign References:
| CN209057368U | 2019-07-02 | |||
| CN204408625U | 2015-06-17 | |||
| CN207269267U | 2018-04-24 | |||
| US20080192962A1 | 2008-08-14 |
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