Title:
SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/166768
Kind Code:
A1
Abstract:
A sensor module according to one embodiment of the present disclosure is equipped with a housing, a sensor substrate, an external connector, a flexible wiring board, and a metal shield case. The flexible wiring board electrically connects between the sensor substrate and the external connector and has a signal line and a ground line. The shield case has a bottom part positioned between the flexible wiring board and the external connector. The external connector has a first connecting pin connected to the signal line, a second connecting pin connected to the ground line, and a third connecting pin connected to the bottom part of the shield case. The bottom part has: a first hole through which the first connecting pin passes; a second hole through which the second connecting pin passes; a third hole through which the third connecting pin passes; and a heat storage part provided to the periphery of the third hole, the heat storage part being covered with a solder material that joins the third connecting pin to the bottom part.
Inventors:
OWAKI HIROFUMI (JP)
AGAWA TOMONORI (JP)
TOGANO KUNIHIKO (JP)
SUZUKI HIROO (JP)
AGAWA TOMONORI (JP)
TOGANO KUNIHIKO (JP)
SUZUKI HIROO (JP)
Application Number:
PCT/JP2021/005010
Publication Date:
August 26, 2021
Filing Date:
February 10, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/225; H01L27/146; H05K9/00
Foreign References:
| JP2011166012A | 2011-08-25 | |||
| JP3012356U | 1995-06-13 | |||
| JP2007258404A | 2007-10-04 | |||
| JP5413231B2 | 2014-02-12 |
Other References:
See also references of EP 4109874A4
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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