Title:
SENSOR PACKAGE, METHOD FOR MANUFACTURING SAME, AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/187091
Kind Code:
A1
Abstract:
The present disclosure pertains to a sensor package, a method for manufacturing the same, and an imaging device, with which it is possible to realize reductions in size and height and also to suppress the occurrence of flare. The sensor package comprises a solid-state imaging element for generating pixel signals by photoelectric conversion in accordance with the luminous energy of incident light, a circuit board electrically connected to the solid-state imaging element, a sensor package board that configures the solid-state imaging element into a sealed state and is positioned on the light-incidence side of the solid-state imaging element, and a lens formed on the lower surface on the solid-state-imaging-element side of the sensor package board. The present disclosure can be applied, for example, to an imaging device or the like.
Inventors:
DOBASHI EIICHIRO (JP)
Application Number:
PCT/JP2021/008044
Publication Date:
September 23, 2021
Filing Date:
March 03, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/225; G02B7/02; G03B17/02; H04N5/357
Domestic Patent References:
| WO2019235247A1 | 2019-12-12 |
Foreign References:
| US20110156187A1 | 2011-06-30 | |||
| JP2019047237A | 2019-03-22 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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