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Patent Searching and Data


Title:
SEPARATING DEVICE AND SEPARATING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/163518
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a separating device and a separating method that make it possible to separate a prescribed number of sheet-shaped components from a bundle of stacked sheet-shaped components without generating creases even when the sheet-shaped components have a welded region on the periphery cut by means of a laser or the like. A separating device 1 is provided with an accommodating section 4, a lift mechanism, a pressing plate 7, and a moving mechanism 5. The accommodating section 4 can accommodate a components bundle D, and has a loading face 69 and an opening 40. The moving mechanism 5 moves the pressing plate 7 in a moving direction crossing a first loading direction. The separating device 1 drives the moving mechanism 5 so as to place the pressing plate 7 at an abutting position such that a pressing face 71 faces at least a portion, on the moving direction side of the components bundle D, of the opening 40 of the accommodating section 4 so that the pressing face can abut an abutted component C. The separating device 1 drives the moving mechanism 5 so as to move the pressing plate 7 in the moving direction with a pressing force in a second loading direction applied to the abutted component C by the pressing face 71 of the pressing plate 7, placed at the abutting position, thereby separating a target component C from the component bundle D.

Inventors:
HAYAKAWA KAZUHIRO (JP)
ICHIKAWA HIROSHI (JP)
TAKEDA KENGO (JP)
HATTORI YOSHITERU (JP)
Application Number:
PCT/JP2022/002145
Publication Date:
August 04, 2022
Filing Date:
January 21, 2022
Export Citation:
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Assignee:
BROTHER IND LTD (JP)
International Classes:
B65H3/54; B65H3/02; B65H3/08
Foreign References:
JPH01187138A1989-07-26
JPS58140919U1983-09-22
JPS55117444U1980-08-19
JP2011126611A2011-06-30
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