Title:
SHEET LAMINATE FOR FORMING RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2016/098697
Kind Code:
A1
Abstract:
[Problem] To provide a sheet laminate for forming a resin film, whereby it becomes possible to deliver a resin film formation sheet from a release sheet easily and it also becomes possible to adhere the resin film formation sheet onto an object of interest in a steady manner.
[Solution] A sheet laminate for forming a resin film according to the present invention is so configured that a release sheet is laminated on a resin film formation layer side of a resin film formation sheet composed of a support sheet and a resin film formation layer, wherein the release sheet has no incision that is located on the resin film formation layer side surface thereof and along the outer periphery of the resin film formation layer.
Inventors:
FUSE KEISHI (JP)
KARASAWA YASUNORI (JP)
SAGAWA YUTA (JP)
KARASAWA YASUNORI (JP)
SAGAWA YUTA (JP)
Application Number:
PCT/JP2015/084790
Publication Date:
June 23, 2016
Filing Date:
December 11, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/683; B32B38/00; C09J7/20; C09J201/00; H01L21/301
Domestic Patent References:
| WO2014157426A1 | 2014-10-02 | |||
| WO2014054781A1 | 2014-04-10 |
Foreign References:
| JP2009130320A | 2009-06-11 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)
Maeda and a Suzuki international patent business corporation (JP)
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