Title:
SHEET-LIKE SEALING MATERIAL, SHEET FOR SEALING AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/241505
Kind Code:
A1
Abstract:
The present invention provides a sheet-like sealing material, the surface of which is easily planarized, while maintaining the interspace between an element and a substrate at the time of sealing the substrate, and which is easily suppressed in warping. A sheet-like sealing material 100 according to the present invention is obtained by sequentially stacking, in the following order, a first resin layer 10 that contains a thermosetting resin (A1) and an inorganic filler (B1), and a second resin layer 11 that contains a thermosetting resin (A2) and an inorganic filler (B2). The lowest melt viscosity of the second resin layer 11 is higher than the lowest melt viscosity of the first resin layer 10. The amount of the inorganic filler (B2) relative to 100 parts by weight of the thermosetting resin (A2) is not less than 1.05 times the amount of the inorganic filler (B1) relative to 100 parts by weight of the thermosetting resin (A1).
Inventors:
MATSUMOTO TAKAKAGE
KITAGAWA ATSUSHI
KITAGAWA ATSUSHI
Application Number:
PCT/JP2020/020336
Publication Date:
December 03, 2020
Filing Date:
May 22, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L23/29; B29C65/02; H01L21/56; H01L23/31
Domestic Patent References:
| WO2019065977A1 | 2019-04-04 |
Foreign References:
| JP2008098419A | 2008-04-24 | |||
| JP2019046930A | 2019-03-22 | |||
| JP2015035567A | 2015-02-19 | |||
| JP2015053470A | 2015-03-19 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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