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Title:
SHEET FOR SEMICONDUCTOR DEVICE FABRICATION
Document Type and Number:
WIPO Patent Application WO/2021/193936
Kind Code:
A1
Abstract:
A sheet for semiconductor device fabrication comprising: a base material, a pressure-sensitive adhesive layer, an intermediate layer, and a film-shaped adhesive, the sheet being configured by laminating the pressure-sensitive adhesive layer, the intermediate layer, and the film-shaped adhesive in this order on the base material, and the intermediate layer including a non-silicone resin having a weight average molecular weight of 100,000 or less as a main component.

Inventors:
IWAYA WATARU (JP)
SATO YOSUKE (JP)
Application Number:
PCT/JP2021/012942
Publication Date:
September 30, 2021
Filing Date:
March 26, 2021
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/28; C08L31/04; C08L83/04; H01L21/301
Domestic Patent References:
WO2018083982A12018-05-11
Foreign References:
JP2013199562A2013-10-03
JP2005248018A2005-09-15
JP2019046827A2019-03-22
JP2012119395A2012-06-21
JP2017103471A2017-06-08
JP2011199015A2011-10-06
JP2011184603A2011-09-22
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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