Title:
SHIPPING INSPECTION DEVICE, PACKAGING DEVICE HAVING SHIPPING INSPECTION DEVICE, AND PACKAGING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/250267
Kind Code:
A1
Abstract:
Provided is a shipping inspection device that can specify a state of a container accommodating a multiplicity of wafers and further assure quality before shipment. A packaging device has a mechanism to retain a container B configured to be capable of accommodating a plurality of wafers with a prescribed interval placed therebetween and insert the container B into a packaging bag. Further, the packaging device has a light source 30 that irradiates lateral surfaces of the wafers accommodated in the container B with light from an outside of the container B before being inserted into the packaging bag, a light source 31 that irradiates the lateral surfaces of the wafers accommodated in the container B with light from a direction different from the light source 30, and light receiving units 35 and 36 that detect reflected light of the light irradiated from the respective light sources. Further, the packaging device has a control unit 20 that controls specification of a presence state of the wafers in the container B on the basis of detection results by the light receiving units 35 and 36.
Inventors:
KUWANO TAKAFUMI (JP)
TOMIZAWA HAJIME (JP)
TOMIZAWA HAJIME (JP)
Application Number:
PCT/JP2019/022875
Publication Date:
December 17, 2020
Filing Date:
June 10, 2019
Export Citation:
Assignee:
MICRO ENG INC (JP)
International Classes:
B65B57/10; B65B51/10; B65B57/00; H01L21/673
Foreign References:
| JP2015058958A | 2015-03-30 | |||
| JP2005064515A | 2005-03-10 | |||
| JP2005064515A | 2005-03-10 | |||
| JPS63253205A | 1988-10-20 | |||
| JPH04142231A | 1992-05-15 |
Attorney, Agent or Firm:
ATENDA PATENT FIRM (JP)
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