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Patent Searching and Data


Title:
SHRINK FILM
Document Type and Number:
WIPO Patent Application WO/2022/138039
Kind Code:
A1
Abstract:
Provided is a shrink film in which a biomass-derived polystyrene resin is used and which has exceptional shrink finishing properties. This shrink film has thermal shrinkage properties mainly in one direction, the shrink film including a styrene-butadiene copolymer that has constituent units derived from biomass-derived styrene monomers, and being such that the content proportion of a resin that has a Vicat softening temperature of 75-90°C (inclusive) relative to the entire mass of the shrink film is 45 mass% or greater.

Inventors:
FUSHIDA YUKI (JP)
MATSUOKA YO (JP)
DOBASHI HIDENORI (JP)
BANNO SHINJI (JP)
Application Number:
PCT/JP2021/044198
Publication Date:
June 30, 2022
Filing Date:
December 02, 2021
Export Citation:
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Assignee:
FUJI SEAL INT INC (JP)
International Classes:
B32B27/00; B29C61/02; B65D25/36; C08J5/18; C08L25/10; G09F3/04
Domestic Patent References:
WO2020080026A12020-04-23
Foreign References:
US3891721A1975-06-24
JP2016505645A2016-02-25
JP2015042711A2015-03-05
JP2014051617A2014-03-20
JP2016210079A2016-12-15
JP2015009515A2015-01-19
JP2020193274A2020-12-03
JP2020196873A2020-12-10
JP2018507297A2018-03-15
JP2020516759A2020-06-11
JP2021126834A2021-09-02
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