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Patent Searching and Data


Title:
SIGNAL PROCESSING DEVICE AND SENSING MODULE
Document Type and Number:
WIPO Patent Application WO/2021/205895
Kind Code:
A1
Abstract:
The present technology provides a signal processing device comprising: a multi-stage branch wiring section that supplies the same signal to a plurality of target elements via multi-stage branched wiring; and logic circuits arranged in the stages of the multi-stage branch wiring section, the wiring between at least some stages in the multi-stage branch wiring section intersecting.

Inventors:
TAYU KENICHI (JP)
Application Number:
PCT/JP2021/012610
Publication Date:
October 14, 2021
Filing Date:
March 25, 2021
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G01C3/06; G01S7/4863; G01S17/894; H04N5/369; H04N5/376
Domestic Patent References:
WO2011061099A12011-05-26
WO2016170833A12016-10-27
Foreign References:
JPH113945A1999-01-06
JP2004289030A2004-10-14
US20170213821A12017-07-27
JP2008282108A2008-11-20
JPH06268065A1994-09-22
JPH07249969A1995-09-26
JPH0621223A1994-01-28
US8782591B12014-07-15
Attorney, Agent or Firm:
IWATA, Masanobu et al. (JP)
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