Title:
SIGNAL TRANSMISSION DEVICE, RECEPTION CIRCUIT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/021510
Kind Code:
A1
Abstract:
In order to enable multi-channel transmission by dividing frequency bands, a transmission unit and a reception unit are provided for each channel. The total number of channels is 3 or more. In any combination of two channels, with respect to the channel to which full-duplex bidirectional communication is applied, any of the reception units comprises a signal suppression unit which suppresses signal components of other channel which is a channel other than the own channel. According to a preferable embodiment, the reception unit has a frequency selection property for the own channel, and comprises an amplification unit which amplifies the received signals. With respect to adjacent channels to which full-duplex bidirectional communication is applied, the amplification unit comprises a gain suppression unit which suppresses the gain of the channel which is either the lower adjacent channel or the upper adjacent channel and which is deficient in the attenuation level of a gain frequency property.
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Inventors:
HINO YASUFUMI (JP)
Application Number:
PCT/JP2011/070005
Publication Date:
February 14, 2013
Filing Date:
September 02, 2011
Export Citation:
Assignee:
SONY CORP (JP)
HINO YASUFUMI (JP)
HINO YASUFUMI (JP)
International Classes:
H04B1/10; H04B13/00; H04J1/00
Foreign References:
| JP2001144661A | 2001-05-25 | |||
| JPH05122549A | 1993-05-18 | |||
| JPH07264571A | 1995-10-13 | |||
| JP2009055379A | 2009-03-12 | |||
| JP2010178144A | 2010-08-12 |
Other References:
SATOSHI FUKUDA ET AL.: "A 12.5+12.5Gb/s full-duplex plastic waveguide interconnect", SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS, 24 February 2011 (2011-02-24), pages 150 - 152, XP011379217
SATOSHI FUKUDA ET AL.: "A 12.5+12. 5Gb/s Full-Duplex Plastic Waveguide Interconnect", 2011 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE ISSCC 2011 / SESSION 8 / ARCHITECTURES & CIRCUITS FOR NEXT GENERATION WIRELINE TRANSCEIVERS, 23 February 2011 (2011-02-23), pages 150 - 152
SATOSHI FUKUDA ET AL.: "A 12.5+12. 5Gb/s Full-Duplex Plastic Waveguide Interconnect", 2011 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE ISSCC 2011, 8 February 2011 (2011-02-08), pages 1 - 29
SATOSHI FUKUDA ET AL.: "A 12.5+12. 5Gb/s Full-Duplex Plastic Waveguide Interconnect", 2011 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE ISSCC 2011 / SESSION 8 / ARCHITECTURES & CIRCUITS FOR NEXT GENERATION WIRELINE TRANSCEIVERS, 23 February 2011 (2011-02-23), pages 150 - 152
SATOSHI FUKUDA ET AL.: "A 12.5+12. 5Gb/s Full-Duplex Plastic Waveguide Interconnect", 2011 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE ISSCC 2011, 8 February 2011 (2011-02-08), pages 1 - 29
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
Yoshiaki Kameya (JP)
Yoshiaki Kameya (JP)
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Claims:
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