Title:
SIGNAL TRANSMISSION MODULE
Document Type and Number:
WIPO Patent Application WO/2018/168336
Kind Code:
A1
Abstract:
This signal transmission module is provided with: a DC/DC converter provided to a first surface (21a) of a multilayer substrate; and a high-frequency signal transmission circuit which is provided to a second surface (21b) of the multilayer substrate. The multilayer substrate is provided with: a first insulating layer (101) and a second insulating layer (105); a ground conductor layer (116) provided between the first insulating layer (101) and the second insulating layer (105); a first conductor pattern (110) which is formed on the first surface (21a), and which, along with the ground conductor layer (116), sandwiches the first insulating layer (101); and a second conductor pattern (112) which is formed on the second surface (21b), and which, along with the ground conductor layer (116), sandwiches the second insulating layer (105). The multilayer substrate (21) includes: a base part (90) in which the DC/DC converter and the high-frequency signal transmission circuit are provided; and a first protruded part (22) which is inserted into a plug.
Inventors:
MATSUMOTO TADAHIKO (JP)
Application Number:
PCT/JP2018/005655
Publication Date:
September 20, 2018
Filing Date:
February 19, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/11; H01R12/73; H01R13/6581; H02M3/155; H05K1/02; H05K3/46
Foreign References:
| JPS60236297A | 1985-11-25 | |||
| JP2016201537A | 2016-12-01 | |||
| JPS5482075A | 1979-06-29 | |||
| JPS63280499A | 1988-11-17 | |||
| JP2011023761A | 2011-02-03 | |||
| JP2011159880A | 2011-08-18 | |||
| JP2016100082A | 2016-05-30 | |||
| JP2006302651A | 2006-11-02 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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