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Title:
SILICA PARTICLES AND PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, SEMICONDUCTOR WAFER PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/171134
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide silica particles that exhibit excellent polishing properties and storage stability. The present invention relates to silica particles such that when the surface silanol group content is expressed as x mass% and the bulk silanol group content is expressed as y mass%, the ratio of the silianol groups present on the surface as expressed by the formula (x/y)×100% is 15% or less.

Inventors:
KYOTANI TOMOHIRO (JP)
DEJIMA EIJI (JP)
SUMITANI NAOKO (JP)
KATO TOMOHIRO (JP)
SAWAI TAKESHI (JP)
Application Number:
PCT/JP2020/006609
Publication Date:
August 27, 2020
Filing Date:
February 19, 2020
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C01B33/18; B24B37/00; C01B33/14; H01L21/304
Domestic Patent References:
WO2008123373A12008-10-16
WO2016159167A12016-10-06
Foreign References:
JP2018109074A2018-07-12
JP2012224524A2012-11-15
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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