SILICA PARTICLES AND PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, SEMICONDUCTOR WAFER PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

Title:

SILICA PARTICLES AND PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, SEMICONDUCTOR WAFER PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2020/171140

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide silica particles that exhibit excellent polishing properties and storage stability. The present invention relates to silica particles such that when the d value measured using wide-angle X ray scattering is expressed as y Å, formula (1) is satisfied. Formula (1): y≥4.2

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Inventors:

KYOTANI TOMOHIRO (JP)
DEJIMA EIJI (JP)
SUMITANI NAOKO (JP)
KATO TOMOHIRO (JP)
SAWAI TAKESHI (JP)

Application Number:

PCT/JP2020/006619

Publication Date:

August 27, 2020

Filing Date:

February 19, 2020

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP (JP)

International Classes:

C01B33/18; B24B37/00; C01B33/14; H01L21/304

Domestic Patent References:

WO2008123373A1	2008-10-16
WO2016159167A1	2016-10-06
WO2008123373A1	2008-10-16
WO2008015943A1	2008-02-07

Foreign References:

JP2018109074A	2018-07-12
JP2012224524A	2012-11-15
JPH1160232A	1999-03-02
JP2010083744A	2010-04-15
JP2018090798A	2018-06-14
JP5967118B2	2016-08-10
JPS6047395B2	1985-10-21
JP2019029142A	2019-02-21
JP2019029143A	2019-02-21

Other References:

G.W. SEARS, JR., ANALYTICAL CHEMISTRY, vol. 28, no. 12, 1956, pages 1981 - 1983
SHINICHI HABA: "Development of Polishing Agent for Semiconductor Integrated Circuit Process", March 2004, KOCHI UNIVERSITY OF TECHNOLOGY DOCTORAL DISSERTATION, pages: 39 - 45
ANONYMOUS: "Aerosil- Fumed Silica Technical Overview", EVONIK INDUSTRIES, 1 December 2015 (2015-12-01), pages 1 - 104, XP055479597, Retrieved from the Internet [retrieved on 20180530]
See also references of EP 3929154A4

Attorney, Agent or Firm:

EIKOH PATENT FIRM, P.C. (JP)

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