Title:
SILICON WAFER TRANSFER/STORAGE METHOD
Document Type and Number:
WIPO Patent Application WO/2017/217186
Kind Code:
A1
Abstract:
The present invention provides a silicon wafer transfer/storage method for transferring a silicon wafer from a first process to a second process which is the next process in a silicon wafer processing process, or for storing the silicon wafer after the first process until being introduced into the second process, the silicon wafer transfer/storage method being characterized in that a polymer with a molecular weight of not less than 100,000 is adsorbed onto a surface of the silicon wafer after the first process, and the silicon wafer, with the polymer adsorbed onto the surface thereof, is transferred or stored until the second process. In this way, there is provided a silicon wafer transfer/storage method with which metal contamination and surface roughening during wafer transfer or storage can be inexpensively suppressed.
Inventors:
OSEKI MASAAKI (JP)
SATO MICHITO (JP)
ISHII KAORU (JP)
SATO MICHITO (JP)
ISHII KAORU (JP)
Application Number:
PCT/JP2017/018964
Publication Date:
December 21, 2017
Filing Date:
May 22, 2017
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| WO2014148399A1 | 2014-09-25 |
Foreign References:
| JP2009255248A | 2009-11-05 | |||
| JPH03256328A | 1991-11-15 | |||
| JPH10120965A | 1998-05-12 | |||
| JPH03248532A | 1991-11-06 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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