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Title:
SILICONE COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/053979
Kind Code:
A1
Abstract:
This silicone composition contains: 100 parts by mass of (A) an organopolysiloxane which has at least one silicon atom-bonded alkenyl group per molecule and has a viscosity at 25°C of 0.01-100 Pa·s; 0.1-100 parts by mass of (B) an organohydrogenpolysiloxane having at least one silicon atom-bonded hydrogen atom per molecule; (C) an addition reaction catalyst; and 10-500 parts by mass of (D) a hollow inorganic filler having an average particle diameter of 100 μm or less. The silicone composition has a high storage elastic modulus under high frequency conditions and gives a cured product having a low density.

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Inventors:
SAKAMOTO AKIRA (JP)
MATSUMOTO NOBUAKI (JP)
ISHIDA KAZUMA (JP)
Application Number:
PCT/JP2020/029614
Publication Date:
March 25, 2021
Filing Date:
August 03, 2020
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/013; C08L83/05; C08L83/07
Foreign References:
JP2017206652A2017-11-24
JP2010155946A2010-07-15
JP2004026875A2004-01-29
JP2006052760A2006-02-23
JPH11269388A1999-10-05
JP2010150399A2010-07-08
JP2014218564A2014-11-20
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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