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Patent Searching and Data


Title:
SINGLE CRYSTAL BATTERY WAFER CUTTING METHOD , SINGLE CRYSTAL BATTERY WAFER, PHOTOVOLTAIC ASSEMBLY AND PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/103195
Kind Code:
A1
Abstract:
Provided are a cutting method for single crystal battery wafer, single crystal battery wafer, a photovoltaic assembly and a preparation method, the single crystal battery wafer is prepared in the following manner: providing a wafer rod (1) with crystal orientation <100> as raw materials; making a growth ridge line (2) of the wafer rod (1) and the adjacent crystal holder ridge line (4) of a squarer crystal holder (3) spaced at an angle of 45 degrees in the circumferential direction, then squaring and slicing the wafer rod (1) to obtain a single crystal silicon wafer, the crystal orientation of the four edges of the single silicon wafer is <110>; preparing the single crystal silicon wafer into a single crystal battery wafer (5), characterized in that, the cutting method comprises the following steps: cutting a weakened portion perpendicular to an edge of the single crystal battery wafer; applying mechanical stress to split the single crystal battery wafer in the weakened portion direction perpendicular to the edge.

Inventors:
YIN BINGWEI (CN)
SUN JUN (CN)
DING SHIYIN (CN)
YANG LEI (CN)
ZHOU FUSHEN (CN)
Application Number:
PCT/CN2018/119518
Publication Date:
May 28, 2020
Filing Date:
December 06, 2018
Export Citation:
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Assignee:
CHENGDU YEFAN SCIENCE AND TECH CO LTD (CN)
International Classes:
H01L31/036; B28D5/04; H01L21/304; H01L31/0352; H01L31/04
Foreign References:
CN103862584A2014-06-18
US5702538A1997-12-30
CN103872157A2014-06-18
CN103367482A2013-10-23
CN105609572A2016-05-25
CN207968385U2018-10-12
Attorney, Agent or Firm:
KING & WOOD MALLESONS (CN)
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