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Title:
SINGLE SURFACE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/225973
Kind Code:
A1
Abstract:
The present invention is a single surface polishing method using a polishing pad to polish a wafer surface, the single surface polishing method being characterized by comprising: monitoring a change in the polishing pad temperature; polishing the wafer surface from the polishing start time under a first condition; and at a time point when the change in the polishing pad temperature changes from rising to falling, switching from the first condition to a second condition to polish the wafer surface. In this manner, edge roll-off can be suppressed by accurately detecting that a natural oxide film has been removed.

Inventors:
SUZUKI KENTA (JP)
OSEKI MASAAKI (JP)
Application Number:
PCT/JP2020/010136
Publication Date:
November 12, 2020
Filing Date:
March 10, 2020
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/015; B24B37/12; B24B49/14; H01L21/304
Domestic Patent References:
WO2011135949A12011-11-03
Foreign References:
JP2010010610A2010-01-14
JP2007129115A2007-05-24
JPH10214807A1998-08-11
JPH08227867A1996-09-03
JPH0794452A1995-04-07
JPH0878369A1996-03-22
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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