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Patent Searching and Data


Title:
SLURRY MANUFACTURING DEVICE AND OPERATING METHOD FOR SLURRY MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/087559
Kind Code:
A1
Abstract:
Provided is a slurry manufacturing method that can suppress reductions in slurry quality, increases in running costs, and reductions in maintainability. A slurry manufacturing device 200 has: a mixing device (suction pump mechanism Y) for manufacturing a slurry F by mixing a liquid R and a powder P; a powder supply device X for supplying the powder P to the mixing device; and a dry box 230 for powder use. An opening (31a, 221) for the powder supply device X is housed in the dry box 230 for powder use.

Inventors:
ONISHI KEIICHIRO (JP)
ASAMI KEIICHI (JP)
OONISHI TATSUAKI (JP)
Application Number:
PCT/JP2018/032580
Publication Date:
May 09, 2019
Filing Date:
September 03, 2018
Export Citation:
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Assignee:
NIHON SPINDLE MFG CO LTD (JP)
International Classes:
B01F23/70; B01F25/60; B01F25/64; H01M4/139; H01M10/0562
Foreign References:
JP2006341191A2006-12-21
JPH0716442A1995-01-20
JP2015035344A2015-02-19
JP2015005372A2015-01-08
JPH0522378U1993-03-23
JPS5625216B21981-06-11
Other References:
See also references of EP 3705175A4
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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