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Patent Searching and Data


Title:
SOCKET FOR INSPECTION OF IC PACKAGE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/259818
Kind Code:
A1
Abstract:
A socket main body (10) is provided with a space (8) that allows horizontal movement of a ground contact pin (40) toward the outer periphery of the socket main body (10), wherein the ground contact pin (40) is attached to the socket main body (10) by the horizontal movement of the ground contact pin (40) in the space (8), so that the socket main body (10) prevents shifting of the ground contact pin (40) in the vertical direction.

Inventors:
TAHARA MASAKI (JP)
MIYAAKI JUNICHI (JP)
SATO MASARU (JP)
Application Number:
PCT/JP2022/020244
Publication Date:
December 15, 2022
Filing Date:
May 13, 2022
Export Citation:
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Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
H01R33/76; G01R31/26; H01R43/00
Foreign References:
JP2004228042A2004-08-12
JP2001110537A2001-04-20
JP2005302345A2005-10-27
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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