Title:
SOCKET, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/145128
Kind Code:
A1
Abstract:
A socket and a semiconductor device using the socket. The socket has an insulating
elastomer sheet made of a fluorocarbon elastomer and in which a through hole is
formed, a metal circuit formed at least a part of the front and back sides of the
elastomer sheet, and a through hole made by forming a metal film on the inner wall
of the through hole formed in the elastomer sheet. The metal circuit on the front
side of the elastomer sheet and the metal circuit on the back side are electrically
interconnected by the through hole made by forming the metal film on the inner
wall. A groove or through hole is formed in at least that part of the elastomer
sheet that surrounds the metal circuit. Consequently, the socket has an excellent
contact terminal part having low resistance, so that the socket can cope with
increased current and high-speed operation.
Inventors:
OUCHI YASUHIRO (JP)
NIKAIDO SHINICHI (JP)
MIYAZAWA HARUO (JP)
NIKAIDO SHINICHI (JP)
MIYAZAWA HARUO (JP)
Application Number:
PCT/JP2007/061539
Publication Date:
December 21, 2007
Filing Date:
June 07, 2007
Export Citation:
Assignee:
FUJIKURA LTD (JP)
OUCHI YASUHIRO (JP)
NIKAIDO SHINICHI (JP)
MIYAZAWA HARUO (JP)
OUCHI YASUHIRO (JP)
NIKAIDO SHINICHI (JP)
MIYAZAWA HARUO (JP)
International Classes:
H01R11/01; H01R33/76; H01R13/24; H01R43/00
Foreign References:
| JP2003151709A | 2003-05-23 | |||
| JP2003077562A | 2003-03-14 |
Attorney, Agent or Firm:
SHIGA, Masatake et al. (Yaesu Chuo-k, Tokyo 53, JP)
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