Title:
SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, AND SOLDER JOINT
Document Type and Number:
WIPO Patent Application WO/2021/205760
Kind Code:
A1
Abstract:
The present invention uses a solder alloy that has an alloy composition containing less than 5 mass ppb of U, less than 5 mass ppb of Th, less than 5 mass ppm of Pb, less than 5 mass ppm of As, 0-0.9 mass% of Bi, and 0-0.3 mass% of Sb, the remaining portion being Sn, that satisfies formula (1), and that has an alpha ray amount of 0.02 cph/cm2 or less. (1): 0.005≤Bi+Sb≤1.2. In formula (1), Bi and Sb each represent the contained amount (mass%) thereof in the alloy composition. By using the solder alloy according to the present invention, it is possible to suppress an increase in viscosity of a solder paste over the course of time, increase mechanical properties by having little difference in temperature (ΔT) between a liquidus line temperature and a solidus line temperature, and suppress occurrence of soft errors.
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Inventors:
KAWASAKI HIROYOSHI (JP)
SHIRATORI MASATO (JP)
KAWAMATA YUJI (JP)
SHIRATORI MASATO (JP)
KAWAMATA YUJI (JP)
Application Number:
PCT/JP2021/006450
Publication Date:
October 14, 2021
Filing Date:
February 19, 2021
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/02; B23K35/22; B23K35/26
Foreign References:
| JP5296269B1 | 2013-09-25 | |||
| JP2017113756A | 2017-06-29 | |||
| JP5019764B2 | 2012-09-05 | |||
| JP6540869B1 | 2019-07-10 | |||
| JP2020055037A | 2020-04-09 | |||
| JP4472752B2 | 2010-06-02 | |||
| JP2005103645A | 2005-04-21 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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