Title:
SOLDER FEEDER, PRINTER, AND PRINT METHOD
Document Type and Number:
WIPO Patent Application WO/2010/090121
Kind Code:
A1
Abstract:
Disclosed is a print technology wherein a solder pool staying on the surface of a mask is driven by means of a squeegee, and solder is applied onto a substrate which is superimposed on the lower surface of a mask. A forward path print process where solder is applied by driving a squeegee in the predetermined forward direction relative to a mask, and a return path print process where solder is applied by driving a squeegee in the returning direction which is reverse to the forward direction are switched alternately. When the squeegee passes through a solder pool on the downstream side in the moving direction before switching in a process where switching is made from any one of the forward path print process or return path print process to the other, the amount of solder of the solder pool is measured. Based on the amount of solder thus measured, a decision is made whether supplement of solder is required or not. Based on the results of the decision whether supplement of solder is required or not, the solder pool is supplemented with solder.
Inventors:
SUMIOKA KOUICHI (JP)
Application Number:
PCT/JP2010/051116
Publication Date:
August 12, 2010
Filing Date:
January 28, 2010
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
SUMIOKA KOUICHI (JP)
SUMIOKA KOUICHI (JP)
International Classes:
B41F15/40; B41F15/08; B41F33/14; H05K3/34
Foreign References:
| JP2006076000A | 2006-03-23 | |||
| JPH08207243A | 1996-08-13 | |||
| JPH0623945A | 1994-02-01 | |||
| JPH106153A | 1998-01-13 | |||
| JP2002283536A | 2002-10-03 | |||
| JPH11138747A | 1999-05-25 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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