Title:
SOLDER PASTE PRINTING SYSTEM AND SOLDER PASTE PRINTING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/070541
Kind Code:
A1
Abstract:
This solder paste printing system includes a printing machine, a detection unit, and a flux state determination unit. The printing machine prints solder paste, which includes solder particles and flux, on a board. The detection unit detects the solder particles and flux in the solder paste printed on the board. The flux state determination unit determines whether the state of the flux is good or bad from the detection result from the detection unit. When it is determined that the flux state is bad by the flux state determination unit, the printing machine executes an operation for changing the state of the flux of the solder paste, before printing is performed on a non-printed board.
Inventors:
KOUCHI MITSURU
HAGA KOKI
TOKUNAGA MASAAKI
OHISHI MITSUHIRO
TANAKA TETSUYA
HAGA KOKI
TOKUNAGA MASAAKI
OHISHI MITSUHIRO
TANAKA TETSUYA
Application Number:
PCT/JP2020/034049
Publication Date:
April 15, 2021
Filing Date:
September 09, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B41F15/12; B41F15/08; B41F35/00; B41M1/12; H05K3/34
Domestic Patent References:
| WO2018047268A1 | 2018-03-15 |
Foreign References:
| JP2004122613A | 2004-04-22 | |||
| JP2003110288A | 2003-04-11 | |||
| JP2012124399A | 2012-06-28 | |||
| JPH09138156A | 1997-05-27 | |||
| US20080156207A1 | 2008-07-03 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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