Title:
SOLDER PRINTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2021/255782
Kind Code:
A1
Abstract:
A solder printing machine that prints paste-like solder on a substrate using a mask and a squeegee that moves on the upper surface of the mask comprises: a bed, a mask frame fixed to the bed and holding the mask, and a squeegee frame that is fixed to the bed and formed separately from the mask frame to support a drive mechanism that drives the squeegee.
Inventors:
FUKAKUSA SHOJI (JP)
Application Number:
PCT/JP2020/023380
Publication Date:
December 23, 2021
Filing Date:
June 15, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
B41F15/08
Domestic Patent References:
| WO2017212541A1 | 2017-12-14 | |||
| WO2017145280A1 | 2017-08-31 |
Foreign References:
| JP2012240225A | 2012-12-10 | |||
| JP2017164948A | 2017-09-21 | |||
| JPH10309794A | 1998-11-24 | |||
| CN101791898A | 2010-08-04 | |||
| JP2012240225A | 2012-12-10 |
Other References:
See also references of EP 4166333A4
Attorney, Agent or Firm:
KYORITSU INTERNATIONAL (JP)
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