ELECTRONIC CARD

Technical Field

The invention is related to the electronic cards in the electronic devices on which the electronic elements are disposed.

The invention is particularly related to a method by which the electronic elements such as sensors etc. can be replaced on the electronic card easily and an electronic card with which such a change can be realized.

State of the Art

Today all electronic devices such as cellular phones, laptops, television, etc. have one or more electronic cards called Printed Circuit Board (PCB).

As electronic cards; the green-colored plain where many components of the electronic circuits are disposed of is called the board. The designer of the card disposes of the components one by one based on the requirements of the boards. The function of each component is different from each other.

One of the components is the sensors. For example, when moisture measurement characteristic of the board is required, the moisture sensor is mounted on the board. Or in case of a temperature measurement is required then temperature sensor is mounted. Consequently, the board has many functions however in case a sensor is required; the appropriate sensor relevant to the desired subject is mounted on the board.

The electronic circuit elements are disposed on the printed circuit boards by using two types of technology. THT (Through Hole PCB), SMT (surface assembly), Through Hole PCB technology (Through Hole Technology - THT) are the conventional production methods. The pins of the electronic circuit elements are disposed on the holes on the printed circuit board and soldered from the other surface of the card.

On the other hand, Surface Mount Technology (Surface Mount Technology - SMT) is a production method in which the elements disposed on the printed circuit board are soldered directly on the surface they are disposed of. While previously printed circuit boards are produced by means of THT technology, today these are mostly replaced by the cards which are produced by SMT technology. Since the pins of the circuit elements used in SMT technology are very small or absent, they are very much smaller than the circuit elements used in THT technology. The electronic circuit elements used in SMT technology is named as surface mount devices (Surface Mount Device - SMD). An element can be placed on two surfaces of the PCB’s used in surface mount technology; also, there can be copper paths on two faces. Today copper paths are also placed within PCB and multi-layered PCBs are produced. The connection of the copper paths disposed on the other layers with the copper paths disposed on the layers is made using the holes whose interior surfaces are coated with tin named Via.

SMD elements are mounted on PCB during production by means of two widely used methods. The first of these methods is soldering by cream solder. In this method, cream solder is put on the surface of the free circuit board on which SMD materials are disposed. Then SMD composing machines composes the materials on the card on which cream solder is put, in an automatic manner. The card is sent to the furnace after this process. The card which is soldered at determined temperatures is cooled and the process is completed.

The second method used in the present state of the art is mounting by means of an adhesive. In this method, an adhesive is applied to the centers of the regions where the materials will be disposed of on the printed circuit board by means of the machines or by using a screen printing method. Then SMD composing machines composes the elements on the card. The adhesive of the card is dried during its stay within the furnace. The cards are soldered in the latest traditional wave soldering machines.

The problem encountered in the present state of the art is to mount the electronic elements such as a sensor etc. in a manner such that they cannot be able to be demounted again. For example, in case an electronic card with a temperature sensor is required to measure moisture, it is not possible to demount the temperature sensor and replace it with a moisture sensor. Board is thrown away totally and a new board is designed on which a moisture sensor is mounted. In a solution for eliminating this problem included within the present state of the art, in order to mount and demount the sensors on the board, by means of making rail type slots, the sensors are mounted on the board in such a manner. However, this rail type mounting element increase the thickness sizes of the board. This presents a disadvantage which is impossible to use in practice rather than presenting a solution.

Still, another invention“W02006020883” titled“solderless component packaging and mounting” and with classification“H05K1/184” included within the present state of the art is related to an apparatus and a method in terms of mounting three dimensioned carrier for one or more electronic elements. The mounting is performed in at least two dimensions. In this mounting process, the electronic element is disposed of in the cavity/slot by means of pressing which is formed on the mounting surface. Said slot comprises a conductive strip. By this means, the communication of the mounted electronic element with the electronic card is enabled. Due to said cavity/slot, the thickness of said electronic card increases. This means that it occupies more place, thus causes a disadvantage in the design of the device in the electronic field.

Yet another invention No“US4039236” titled as“Modular breadboard” is related to a modular electronic card which comprises two panels parallel to each other to which footed brackets ate mounted. The circuit elements and other elements belong to the module which will be mounted are locked to one or two panels by means of spring/flexible elements between two panels. The modules and panels, multi and solderless spring terminals and connections and temporary connecting cables are formed as an experimental circuit. Aim of the Invention

In order to eliminate the disadvantages included within the present state of the art, the invention aims to replace the replaceable electronic element on the electronic card easily. Another aim of the invention is to eliminate the need for replacing the electronic card for replacing an electronic element.

Another aim of the invention is to decrease the production cost and provide an application saving.

Description of Figures

Figure 1 is a general perspective view of the disassembly of the invention.

Figure 2 is a general perspective view of the assembly of the invention.

Description of Reference Numbers

Detailed Description of the Invention

The invention is a method for mounting the electronic elements (2) on a designed electronic card (1) in a solderless manner without performing fitting/attaching action. In Figure 1 , there is a general perspective view of the disassembly of the invention. An electronic card (1) and the assembly regions (11) formed on this card (1) are seen in Figure 1. Electronic elements (2) will be engaged in these assembly regions (11). Also, at the edge of the assembly regions (11), a connection element (12) is formed for said engagement. In the same manner a connection element (21) is formed at the edge of the element (2) for the engagement of the electronic element (2) to the assembly region (11).

In Figure 2 there is a general perspective view of the assembly of the invention. As it can be seen in the Figure, said electronic element (2) is engaged to the assembly region (11) on the electronic card (1) by means of the connection elements (12, 21). During this engagement, soldering, fitting, seating etc. methods are not used. After the engagement process, the electronic element (2) can be demounted in an easy manner. For this process, methods such as heating, soldering, demounting, application of force are not used. When required an electronic element (2) can be engaged with the electronic card (1) in a practical manner.

The assembly regions (11) seen in Figure 1 are in a region form formed on the electronic card (1), there are not in the form of a gap, cavity, hole form. Therefore, they do not constitute an additional form which will cause the card (2) to be ticker.

Once again, the connection elements (12, 21) seen in Figure 1 and 2 are pet materials, provide engagement and transmission between the electronic element (2) and the electronic card (1) without any heating and physical process.

Once again said electronic element (2) seen in Figure 1 and 2 is preferably a sensor. A preferred thermometer sensor is engaged to said electronic card (1), then if required a moisture sensor can be engaged in an easily detachable manner.