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Patent Searching and Data


Title:
SOLDERLESS MOUNTING/DEMOUNTING OF AN ELECTRONIC MATERIAL TO AN ELECTRONIC CARD
Document Type and Number:
WIPO Patent Application WO/2020/101610
Kind Code:
A3
Abstract:
The invention is related to a mounting method in which the electronic element (2) is mounted in a demountable manner on the mounting region (11) formed on a designed electronic card (1) in a solderless manner without the requirement of engagement/attachment process and temperature or physical process; is connected with the electronic card (1) by means of the connection element (22) formed on one side of the electronic element (2) and the connection element (12) formed on the mounting region (11).

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Inventors:
TAYSİ OLCAY (TR)
Application Number:
PCT/TR2019/050708
Publication Date:
July 09, 2020
Filing Date:
August 27, 2019
Export Citation:
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Assignee:
NETOP TEKNOLOJI YAZILIM SAN VE TIC A S (TR)
International Classes:
H01R12/71; H01R13/42; H05K1/18
Domestic Patent References:
WO2011063213A12011-05-26
WO2009052704A12009-04-30
Foreign References:
US20180138616A12018-05-17
DE102013211142A12014-12-18
Attorney, Agent or Firm:
SADE DANISMANLIK PATENT ARGE HIZMETLERI TICARET LIMITED SIRKETI (TR)
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