Title:
SOLDERLESS JOINT ARRANGEMENT
Document Type and Number:
WIPO Patent Application WO/2018/130591
Kind Code:
A3
Abstract:
A solderless joint arrangement comprising a receptacle (11) of a PCB (10) arranged to receive a conductive compliant pin, the receptacle (11) comprising a conductive portion (12) for contact with the compliant pin wherein the receptacle is positioned on a flexible portion (20) of the PCB.
Inventors:
BOTTNER MICHEL (US)
CATHERIN DANIEL (US)
HYVERNAT STÉPHANE (US)
CATHERIN DANIEL (US)
HYVERNAT STÉPHANE (US)
Application Number:
PCT/EP2018/050593
Publication Date:
October 04, 2018
Filing Date:
January 10, 2018
Export Citation:
Assignee:
ITRON GLOBAL SARL (US)
International Classes:
H05K1/11; H05K3/32; H01R12/58; H05K1/02
Domestic Patent References:
| WO2009062539A1 | 2009-05-22 | |||
| WO2008046188A1 | 2008-04-24 | |||
| WO1998057165A1 | 1998-12-17 |
Foreign References:
| GB2245770A | 1992-01-08 |
Attorney, Agent or Firm:
MORRALL, Jonathan (GB)
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