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Patent Searching and Data


Title:
SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2013/150839
Kind Code:
A1
Abstract:
This solid-state image pickup apparatus is provided with: a semiconductor layer (17); a photoelectric conversion section or a charge holding section, which is disposed on the light receiving surface side of the semiconductor layer (17); a connecting section (21), which is formed on the semiconductor layer (17), and reads out signal charges generated by means of the photoelectric conversion section or the charge holding section; a charge accumulating section (23) having the signal charges accumulated therein, said signal charges having been read out by means of the connecting section (21); a potential barrier section (22), which is provided between the connecting section (21) and the charge accumulating section (23); and an element isolating section (27), which is configured of a trench (54) surrounding the side surfaces of the connecting section (21), and an insulating layer (25) formed in the trench (54).

Inventors:
KOGA FUMIHIKO (JP)
TAKEO AKIRA (JP)
Application Number:
PCT/JP2013/055113
Publication Date:
October 10, 2013
Filing Date:
February 27, 2013
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
H01L27/146; H04N5/374
Foreign References:
JP2010098315A2010-04-30
JP2009147067A2009-07-02
JP2011138905A2011-07-14
JP2005101864A2005-04-14
JP2011243996A2011-12-01
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Patent business corporation wings international patent firm (JP)
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