Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/075116
Kind Code:
A1
Abstract:
Provided is a solid-state imaging device with which the image quality of the solid-state imaging device can be further improved. The solid-state imaging device comprises, in order from a light incident side, at least: an on-chip lens; a plurality of filters that transmit specific light; and a semiconductor substrate on which a photoelectric conversion unit is formed. An effective imaging region is formed, in which a first light-blocking film is disposed between the filters that transmit specific light. A non-imaging region is formed, in which a second light-blocking film is disposed between the plurality of filters that transmit specific light and the semiconductor substrate so as to cover a light incident surface of the semiconductor substrate. An excavated portion that is formed by excavating the light incident surface of the semiconductor substrate is provided to a boundary region of the effective imaging region and the non-imaging region as well as a region near the boundary region.
Inventors:
OOI KOHEI (JP)
FUKAGAWA HIRONOBU (JP)
FUKAGAWA HIRONOBU (JP)
Application Number:
PCT/JP2020/028084
Publication Date:
April 22, 2021
Filing Date:
July 20, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/369
Domestic Patent References:
WO2014156933A1 | 2014-10-02 |
Foreign References:
JP2013182906A | 2013-09-12 | |||
JP2019160847A | 2019-09-19 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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